DN-401 High-speed Nickel Electroplating Process
1. Designed for low stress high speed nickel plating connector electronic products.
2. Low stress system, excellent malleability suitable for assembly.
3. Good anti-discoloration performance, effectively prevent the tin layer discoloration.
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Solution composition and operating conditions
nickel sulfamate 400-800 ml/l boric acid 35-45g/l Nickel chloride 5-15g/l DN-401 softener 8-12 ml/l DN-402 leveler 0.1-0.3 ml/l DN-01 wetting agent 1-3 ml/l pH 3.5-4.5 Temperature 50-60 ℃ current density 5-60 amps/square decimeter
DN-401 High-speed Nickel Electroplating Process
1. Designed for low stress high speed nickel plating connector electronic products.
2. Low stress system, excellent malleability suitable for assembly.
3. Good anti-discoloration performance, effectively prevent the tin layer discoloration.
Still deciding? Get samples first, Contact US !
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CONTACT US
Guangdong Dazhi Chemical Technology Co., Ltd
Email: sales@dazhichem.com
Phone/WeChat: 86-18520125168
Address: No.1 Tianyuan East Road, Yonghe Economic Zone, Huangpu District, Guangzhou City
