• DZ-90H Copper Electroplating Process
DZ-90H Copper Electroplating Process
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DZ-90H Copper Electroplating Process

1. The system current density ranges from 0.5 to 4 A/dm2. 2. Superior deep plating performance, can cover all CD range on high aspect ratio board. 3. Superior surface dispersion performance for complex graphic design. 4. Excellent metallurgical properties.

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  • Product Description
  • Solution composition and operating conditions

     

    Copper sulfate67.5-90g/l
    sulfuric acid170-200g/l
    chloride ion50-80 mg/l
    DZ-90H C3-15 ml/l
    DZ-90H A1-4 ml/l
    Temperature20-30 ℃
    current density0.5-4 amps/square decimeter

     

DZ-90H Copper Electroplating Process

1. The system current density ranges from 0.5 to 4 A/dm2. 2. Superior deep plating performance, can cover all CD range on high aspect ratio board. 3. Superior surface dispersion performance for complex graphic design. 4. Excellent metallurgical properties.

Still deciding? Get samples first,  Contact US !

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