
DZ-90H Copper Electroplating Process
1. The system current density ranges from 0.5 to 4 A/dm2.
2. Superior deep plating performance, can cover all CD range on high aspect ratio board.
3. Superior surface dispersion performance for complex graphic design.
4. Excellent metallurgical properties.
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Solution composition and operating conditions
Copper sulfate 67.5-90g/l sulfuric acid 170-200g/l chloride ion 50-80 mg/l DZ-90H C 3-15 ml/l DZ-90H A 1-4 ml/l Temperature 20-30 ℃ current density 0.5-4 amps/square decimeter
DZ-90H Copper Electroplating Process
1. The system current density ranges from 0.5 to 4 A/dm2.
2. Superior deep plating performance, can cover all CD range on high aspect ratio board.
3. Superior surface dispersion performance for complex graphic design.
4. Excellent metallurgical properties.
Still deciding? Get samples first, Contact US !
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