Acid copper additive

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ULTRA Acid Bright Copper Plating Process

ULTRA Acid Bright Copper Plating Process

1. The tolerance of impurities in the plating solution is high, easy to control, and the filling flatness of the coating is excellent. 2. The coating is not easy to produce pinholes, low internal stress and good ductility. 3. The current density range is wide, and the coating filling flatness is as high as 75% to achieve bright effect. 4. The deposition speed is very fast. Under the current density of 4.5 amperes/square decimeter, a copper layer of 1 micron can be plated per minute, thus shortening the plating time. 5. Wide scope of application, can be applied to iron, zinc alloy, copper alloy, plastic and other different types of substrate.

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Black card

Black card

1. Perfect mirror gloss can be obtained. 2. Brightness, leveling performance is very high. Especially in the case of low current gloss is more perfect. 3. The operating temperature range is very wide, and electroplating can also be carried out at high temperature. 4. Filling effect is good, brightener consumption is less, economical. 5. Will not be affected by the decomposition of brighteners.

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Red card

Red card

1. Perfect mirror gloss can be obtained. 2. Brightness, leveling performance is very high. Especially in the case of low current gloss is more perfect. 3. The operating temperature range is very wide, and electroplating can also be carried out at high temperature. 4. Filling effect is good, brightener consumption is less, economical. 5. Will not be affected by the decomposition of brighteners.

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DZ-007 High Leveling Acid Copper Brightener

DZ-007 High Leveling Acid Copper Brightener

1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting. 2. The coating has good ductility, low internal stress and good bonding force to the nickel layer, which is an ideal electroplating layer. 3. When the temperature of the plating solution is high, the brightness will not be significantly reduced in the low current region, and a high-brightness coating can be obtained in a short time.

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DZ-661 Barrel plating acid copper brightener

DZ-661 Barrel plating acid copper brightener

1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting. 2. The coating has good ductility and low internal stress, which is an ideal electroplating layer. 3. The plating solution is stable and the treatment cycle is long. 4. Can be used for barrel plating process, can also be used for shake plating process.

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DZ-662 Acid copper brightener for plastics

DZ-662 Acid copper brightener for plastics

1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting. 2. The coating has good ductility and low internal stress, which is an ideal electroplating layer. 3. The plating solution is stable and the treatment cycle is long. 4. Dedicated for plastic acid copper plating process, can also be used for barrel plating process.

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DZ-663 Acid copper plating brightener

DZ-663 Acid copper plating brightener

1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting. 2. The coating has good ductility and low internal stress, which is an ideal electroplating layer. 3. The plating solution is stable and the treatment cycle is long. 4. Dedicated to shake plating process.

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DZ-200 Printing barrel plating acid copper additive

DZ-200 Printing barrel plating acid copper additive

1. The coating has good ductility and low internal stress. 2. The surface of the coating is smooth and does not need to be reground. 3. Can be plated under high current conditions. 4. Long-term stable hardness and grain structure (HV210-220). 5. dedicated to the printing cylinder electronic engraving plate making process.

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DZ-90H Copper Electroplating Process

DZ-90H Copper Electroplating Process

1. The system current density ranges from 0.5 to 4 A/dm2. 2. Superior deep plating performance, can cover all CD range on high aspect ratio board. 3. Superior surface dispersion performance for complex graphic design. 4. Excellent metallurgical properties.

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DCu-3200 copper sulphate additive

DCu-3200 copper sulphate additive

1. The surface of the coating is fine, beautiful and matte. 2. The coating is extremely uniform. 3. Single additive, easy operation and management, excellent stability. 4. and a variety of nickel series plating solution (gloss, semi-gloss, low gloss) with the use of, can achieve good matte sand coating.

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