ULTRA Acid Bright Copper Plating Process
1. The tolerance of impurities in the plating solution is high, easy to control, and the filling flatness of the coating is excellent.
2. The coating is not easy to produce pinholes, low internal stress and good ductility.
3. The current density range is wide, and the coating filling flatness is as high as 75% to achieve bright effect.
4. The deposition speed is very fast. Under the current density of 4.5 amperes/square decimeter, a copper layer of 1 micron can be plated per minute, thus shortening the plating time.
5. Wide scope of application, can be applied to iron, zinc alloy, copper alloy, plastic and other different types of substrate.
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Solution composition and operating conditions
Copper sulfate 195-255g/l sulfuric acid 50-100g/l chloride ion 80-100 mg/l Ultra Mu 8-10 ml/l Ultra A 0.6-0.8 ml/l Ultra B 0.4-0.6 ml/l Temperature 18-35 ℃ current density 1.5-8 amps/square decimeter Production maintenance: Ultra Mu 30-50 ml/kH Ultra A 50-60 ml/kH Ultra B 30-50 ml/kH
ULTRA Acid Bright Copper Plating Process
1. The tolerance of impurities in the plating solution is high, easy to control, and the filling flatness of the coating is excellent.
2. The coating is not easy to produce pinholes, low internal stress and good ductility.
3. The current density range is wide, and the coating filling flatness is as high as 75% to achieve bright effect.
4. The deposition speed is very fast. Under the current density of 4.5 amperes/square decimeter, a copper layer of 1 micron can be plated per minute, thus shortening the plating time.
5. Wide scope of application, can be applied to iron, zinc alloy, copper alloy, plastic and other different types of substrate.
Still deciding? Get samples first, Contact US !
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Guangdong Dazhi Chemical Technology Co., Ltd
Email: sales@dazhichem.com
Phone/WeChat: 86-18520125168
Address: No.1 Tianyuan East Road, Yonghe Economic Zone, Huangpu District, Guangzhou City
