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Tin plating
DSN-961 Advanced Acid Bright Tin Plating Process
1. The plating solution is stable and easy to control.
2. The coating is bright, with excellent weldability and corrosion resistance.
3. Can be used for hanging plating and barrel plating.
DZ-8405 High-speed electroplating bright pure tin process
This process has a unique system, and can obtain a uniform and stable coating in a wide range of bath operating temperature.
2. The bright and solderability of the coating is excellent, and the organic composition is very low.
3. In line with the test standards in the electronics industry, the electronic products have a very high quality assurance, suitable for electronic components plating.
DZ-8406 High-speed electroplating matte pure tin process
1. This work is a reflow, pure tin process, specially designed for medium and high speed plating equipment, can be used for terminal plating and wire or line plating.
2. In a wide range of temperature and current density, a pure tin coating with very little organic content, strong covering ability, good ductility and good solderability is electroplated.
3. The surface morphology of the coating is uniform and stable, and is suitable for lead-free finishing of "low-whisker contact line.
DZ-8407 Sulfuric Acid Matte Tin Plating Process
1. Matte tin process, can produce solderable corrosion resistant coating.
This process produces high plating efficiency even at low metal concentrations, resulting in better resistance and dispersion in holes with high aspect ratios.
DZ-8408 Chemical Immersion Tin Process
1. The coating is dense and uniform.
2. The coating has good toughness, conductivity and ductility.
3. Good washability, coating is not easy to appear washing marks and residual substances.
4. The plating solution is not easy to be turbid and has a long service life.
5. Suitable for chemical immersion of tin on copper substrates.
DZ-8409 Chemical Immersion Tin Process
DZ-8409 is a new type of environmental protection chemical tin precipitation process, which has the characteristics of stable performance, convenient operation and economy. DZ-8409 at 55 ℃ for 10 minutes, a pure tin layer of 0.8-1.2 microns can be obtained on the copper surface. Compared with the traditional inorganic immersion tin, the tin sinking rate is faster, the performance is more reliable, and the tin whisker is not easy to produce. The obtained tin layer has good solderability.