• DZ-007 High Leveling Acid Copper Brightener
DZ-007 High Leveling Acid Copper Brightener
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DZ-007 High Leveling Acid Copper Brightener

1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting. 2. The coating has good ductility, low internal stress and good bonding force to the nickel layer, which is an ideal electroplating layer. 3. When the temperature of the plating solution is high, the brightness will not be significantly reduced in the low current region, and a high-brightness coating can be obtained in a short time.

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  • Product Description
  • Solution composition and operating conditions

     

    Copper sulfate180-240g/l
    sulfuric acid45-90g/L
    chloride ion80-100 mg/l
    DZ-007MU opening agent4-6 ml/l
    DZ-007A walking agent0.4-0.8 ml/l
    DZ-007B brightener0.1-0.3 ml/l
    Temperature15-40 ℃
    current density1-6 amps/square decimeter
    Production maintenance: 
    DZ-007MU opening agent30-60 ml/kH
    DZ-007A walking agent60-60 ml/kH
    DZ-007B brightener40-60 ml/kH

     

DZ-007 High Leveling Acid Copper Brightener

1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting. 2. The coating has good ductility, low internal stress and good bonding force to the nickel layer, which is an ideal electroplating layer. 3. When the temperature of the plating solution is high, the brightness will not be significantly reduced in the low current region, and a high-brightness coating can be obtained in a short time.

Still deciding? Get samples first,  Contact US !

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