
DZ-007 High Leveling Acid Copper Brightener
1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting.
2. The coating has good ductility, low internal stress and good bonding force to the nickel layer, which is an ideal electroplating layer.
3. When the temperature of the plating solution is high, the brightness will not be significantly reduced in the low current region, and a high-brightness coating can be obtained in a short time.
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Solution composition and operating conditions
Copper sulfate 180-240g/l sulfuric acid 45-90g/L chloride ion 80-100 mg/l DZ-007MU opening agent 4-6 ml/l DZ-007A walking agent 0.4-0.8 ml/l DZ-007B brightener 0.1-0.3 ml/l Temperature 15-40 ℃ current density 1-6 amps/square decimeter Production maintenance: DZ-007MU opening agent 30-60 ml/kH DZ-007A walking agent 60-60 ml/kH DZ-007B brightener 40-60 ml/kH
DZ-007 High Leveling Acid Copper Brightener
1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting.
2. The coating has good ductility, low internal stress and good bonding force to the nickel layer, which is an ideal electroplating layer.
3. When the temperature of the plating solution is high, the brightness will not be significantly reduced in the low current region, and a high-brightness coating can be obtained in a short time.
Still deciding? Get samples first, Contact US !
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