
DZ-663 Acid copper plating brightener
1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting.
2. The coating has good ductility and low internal stress, which is an ideal electroplating layer.
3. The plating solution is stable and the treatment cycle is long.
4. Dedicated to shake plating process.
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Solution composition and operating conditions
Copper sulfate 100-140g/l sulfuric acid 80-120g/l chloride ion 60-100 mg/l DZ-663MU opening agent 4-6 ml/l DZ-663A walking agent 0.2-0.4 ml/l DZ-663B brightener 0.1-0.3 ml/l Temperature 15-30 ℃ current density 0.5-5 amps/square decimeter
DZ-663 Acid copper plating brightener
1. In a wide range of current density, it can obtain fast mirror brightness and high leveling, and it is not easy to produce pinholes and pitting.
2. The coating has good ductility and low internal stress, which is an ideal electroplating layer.
3. The plating solution is stable and the treatment cycle is long.
4. Dedicated to shake plating process.
Still deciding? Get samples first, Contact US !
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