DZ-200 Printing barrel plating acid copper additive
1. The coating has good ductility and low internal stress.
2. The surface of the coating is smooth and does not need to be reground.
3. Can be plated under high current conditions.
4. Long-term stable hardness and grain structure (HV210-220).
5. dedicated to the printing cylinder electronic engraving plate making process.
Still deciding? Get samples first, Contact US !
View similar products
Tag list
- Product Description
-
Solution composition and operating conditions
Copper sulfate 200-240g/l sulfuric acid 50-70g/l chloride ion 80-100 mg/l DZ-200 opening agent 6-8 ml/L DZ-201 Supplements 2-3 ml/l DZ-202 Supplements Supply Temperature 40-50℃ current density 10-25 amps/square decimeter
DZ-200 Printing barrel plating acid copper additive
1. The coating has good ductility and low internal stress.
2. The surface of the coating is smooth and does not need to be reground.
3. Can be plated under high current conditions.
4. Long-term stable hardness and grain structure (HV210-220).
5. dedicated to the printing cylinder electronic engraving plate making process.
Still deciding? Get samples first, Contact US !
Products Category
Tag list
Inquire Now
Note: Please leave your email address, our professionals will contact you as soon as possible!
CONTACT US
Guangdong Dazhi Chemical Technology Co., Ltd
Email: sales@dazhichem.com
Phone/WeChat: 86-18520125168
Address: No.1 Tianyuan East Road, Yonghe Economic Zone, Huangpu District, Guangzhou City
